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Glass Wafers

Wafers made of technical and optical glass

Typical Applications

  • Glass wafers for anodic bonding with silicon
  • Microlithography applications
  • Wafer glass for semiconductor technology
  • Optical substrates
  • Substrate for micro-optics
  • Micro-electromechanical systems (MEMS)
  • Glass substrates for electronic circuits
  • Wafers for micro-structuring applications
  • Replacement for PYREX® wafers
  • Electronic packaging

The term "wafer" originally initially in the semiconductor industry and refers to the typical shape of a round silicon wafer with SEMI-standard-flat (see figure "Typical glass wafer shape" below). Our extensive range of high-quality glass wafers includes wafers made from a wide selection of specialty glass materials.

We regularly manufacture polished glass wafers made of borosilicate glass like BOROFLOAT® or MEMpax® from SCHOTT for the semiconductor industry. Both materials have nearly the same thermal expansion coefficient as PYREX 7740, which CORNING discontinued many years ago. They represent high-quality replacement materials for PYREX®. Such borosilicate glass wafers are often used for the anodic bonding processes of glass with silicon as the thermal expansion of these materials is similar to the one of silicon.

Besides the borosilicate glass wafers mentioned before, we produce wafers based on low-alkali or alkali-free glass materials like AF 32® eco, 1737F, EAGLE 2000, and AF 45. Also, wafers from optical glasses like BK7, UV-grade Fused Silica, or quartz glass are part of our wafer manufacturing program. Furthermore, we fabricate glass wafers from quality thin and ultra-thin glass materials like AS 87 eco, D 263 T, and our low-cost selected float glass materials. Please find an overview of the glass materials we use to produce glass wafers on this website under the heading "Standard Glass Wafers".

Typical glass wafer shape

Borofloat glass wafer

The picture above shows a double-side polished round glass wafer substrate made of borosilicate glass material. Such glass wafers are typically used for anodic bonding with silicon and MEMS-technology applications.

Depending on the version, our wafers have either polished or high-quality fire-polished surfaces. The fire-polished glass wafers often offer an even lower micro-roughness and better smoothness than mechanically polished glass materials. Our standard glass wafers usually provide excellent flatness and surface quality. For fire-polished glass materials, these parameters ultimately depend on the raw glass's properties and precision. However, they often are comparable or even better than what is achievable with a standard mechanical glass polishing process. Hence, numerous MEMS applications and a variety of micro-optical applications base on these precision glass wafers. For some of the thin and ultra-thin glasses, the packaging of optoelectronic semiconductors is a universal application. Many wafers of these unique, high-quality glass materials allow a wide range of scientific and research applications.

We also manufacture glass wafers for moderate requirements that use more economically priced glass types like our selected float glass. This glass is often an option for the manufacturing of so-called "dummy wafers". Such glass-wafers can lead to significant cost savings to the customer and are part of our daily production.

Our standard glass wafers can have SEMI-standard-flats known from silicon wafers often used for the fabrication of semiconductors. Of course, CNC-machining of custom dimensions and shapes is part of our manufacturing capabilities. At sufficiently large production quantities, specific CNC-machining steps and a customized configuration design are possible. In mass production, we can also carry out customer-specific edge form processing and apply notches. In addition to the specifications listed in this datasheet, we have the technology and capabilities for the precision fabrication of custom glass wafers with a decreased total thickness variation (TTV) and increased surface quality or custom polishing finishes. If you have any queries about our glass-wafer manufacturing capabilities, please contact us.

Please use our inquiry form to request a quotation for your glass wafers made of borosilicate glass or any other glass material based on a custom design. Alternatively, ask for an offer for our regularly obtainable glass-wafers listed on this website. Just click on one of the possible wafer thicknesses shown to initiate the RFQ process.

 

To send an inquiry about a custom-machined glass wafer you haven't found here, please click on the following button.

 

Request for quotation for
custom glass wafers

 

Standard Glass Wafers

The following wafers are available at almost any time in all standard millimeter and inch diameters, usually even as part of our 48h-Express Optics Service.


Wafer Glass Materials

and Standard Thicknesses

Wafers, CNC-precision-cut, without bevel:

If required, with SEMI-standard-flat (please specify if needed). The TTV and surface quality depend on the selected material:

Possible diameters in this version
(unless otherwise stated)

  • 50 mm / 2" (= 50,8 mm)
  • 75 mm / 3" (= 76,2 mm)
  • 100 mm / 4" (= 101,6 mm)
  • 150 mm / 6" (= 152,4 mm)
  • 200 mm / 8" (= 203,2 mm)
  • 300 mm / 12" (= 304,8 mm)
  • Custom diameters

Click on glass thickness to request a quote:

Thickness
(mm)

Nominal thickness
tolerance
(mm)

48h-Express Service
Wafer made of AF 32® eco
Alkali-free glass from SCHOTT
0,10 ±0,015 -
0,20 ±0,020
0,30 ±0,020
0,40 ±0,020
0,50 ±0,300
Wafer made of AF 45
Alkali-free modified borosilicate glass from SCHOTT
0,70 ±0,050
Wafer made of AS 87 eco
Ultra-thin aluminosilicate glass from SCHOTT
0,175 ±0,010
Wafer made of BK7
Optical glass from SCHOTT
1,00 ±0,100
1,00 ±0,025
  • Double side optically polished
  • Maximum diameter of 200 mm
Wafer made of BOROFLOAT® 33
Borosilicate glass from SCHOTT
0,70 ±0,05
1,10 ±0,05
Wafer made of D 263 T
Ultra-thin borosilicate display glass from SCHOTT
0,175 ±0,015
0,210 ±0,020
0,300 ±0,020
0,400 ±0,020
0,550 ±0,050
0,700 ±0,050
1,100 ±0,050
Wafer made of EAGLE2000
Alkali-free glass from CORNING
0,700 ±0,070
1,100 ±0,100
Wafer made of 1737F
Alkali-free boro-aluminosilicate glass from CORNING
0,700 ±0,070
1,100 ±0,100
Wafer made of MEMpax®
Borosilicate thin-glass from SCHOTT
(replacement für PYREX® Wafers)
0,200 ±0,012
0,300 ±0,012
0,400 ±0,015
0,500 ±0,018
(Max. diameter 200 mm or 8")
Wafer made of selected float glass
Iron reduced high-quality soda-lime glass
0,40 ±0,05
0,55 ±0,05
0,70 ±0,05
0,95 ±0,05
1,00 ±0,10
Wafer made of UV-grade quartz glass
Optical quartz glass (Fused Silica)
0,50 ±0,05
1,00 ±0,10
  • Double side optically polished
  • Transmission > 80% already at 185 nm
  • Maximum diameter of 125 mm
    (150 mm if no flat required)

Wafer made of ITO-coated glass
Conductive and transparent layers on various glass materials:

The thicknesses marked with "" are also available within 48–h Express Service.

Glass wafers optically polished on both sides

In general, all glasses can be additionally polished on both sides if desired and when the production quantities are sufficiently large. However, this is not always advantageous because almost all of the glasses we process already have excellent optical quality. The following glass wafers have an additional, high-quality, double-sided optical polishing finish. Wafer notches are also possible at reasonable production quantities.

Please also consider using our standard 100 mm dia. polished glass wafers made of BOROFLOAT®, which are always available and listed below. This material is ideally suited to replace wafers from the no longer available PYREX®.

Double Side Polished Wafers,
ground and C-shaped edge:

Possible diameters in this version

  • 50 mm / 2" (= 50,8 mm)
  • 75 mm / 3" (= 76,2 mm)
  • 100 mm / 4" (= 101,6 mm)
  • 150 mm / 6" (= 152,4 mm)
  • 200 mm / 8" (= 203,2 mm)
  • 300 mm / 12" (= 304,8 mm)
  • Custom diameters

Glass Wafers made of BOROFLOAT®, double-side optically polished and nearly always available:

  • ø 100 mm (+/-0,2)
  • Total thickness variation (TTV) < 10 μm
  • Surface quality better than 60-40 s&d
  • Ground SEMI-standard Flat 32,5 mm (+/-1,0)

Thickness
(mm)

Nominal thickness
tolerance
(mm)

48h-Express Service
0,500 ±0,015
0,525 ±0,020
0,700 ±0,020
Total thickness variation down to < 3 µm is available on request.
The thicknesses marked with "" are also available within 48–h Express Service.

Of course, other precision CNC-machining and polishing options are feasible for all precision glass wafers at larger batch quantities. Please send an inquiry if the glass wafers above don't meet your MEMS, silicon, or semiconductor process requirements or if your application requires a unique design, sophisticated polishing finish, an increased flatness, lower TTV, or another type of material.

 

Request custom-polished wafers

 

All given details and specifications are mean reference values and are not guaranteed. Also, please consider our "Notes on technical specifications".

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