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Glass Wafers

Wafers made of technical and optical glass

Typical Applications

  • Glass wafers for anodic bonding with silicon
  • Microlithography applications
  • Wafer glass for semiconductor technology
  • Optical substrates
  • Substrate for micro-optics
  • Micro-electromechanical systems (MEMS)
  • Glass substrates for electronic circuits
  • Wafers for micro-structuring applications
  • Replacement for PYREX® wafers
  • Electronic packaging

The term "wafer" originally emerged in the semiconductor industry and refers to the typical shape of a round silicon wafer with SEMI-standard-flat (see figure "Typical glass wafer shape" below). Our extensive range of high-quality glass-wafers includes wafers made from a wide selection of specialty glass materials.

For the semiconductor industry, we regularly manufacture polished glass wafers made of borosilicate glass like BOROFLOAT® or MEMpax® from SCHOTT. Both materials have about the same coefficient of thermal expansion as PYREX 7740 glass from CORNING, which has been discontinued many years ago. They represent higher-quality replacement materials for PYREX®. Such borosilicate glass wafers are often used for anodic bonding processes of glass with silicon as the thermal expansion of these materials is similar to the one of silicon.

As well we produce glass wafers of low-alkali or alkali-free glass like AF 32® eco, 1737F, EAGLE 2000, and AF 45 and also of optical glass types like BK7, UV-grade Fused Silica, or quartz glass. Besides, we fabricate glass wafers from quality thin and ultra-thin glass types like AS 87 eco or D 263 T and not least from our low-cost selected float glass materials. An overview of the glass materials we use for the production of glass wafers and the thicknesses available almost at any time can be found on this website under the heading "Standard Glass Wafers".

 

Typical glass wafer shape

Borofloat glass wafer

The picture above shows a double side polished round glass wafer substrate made of borosilicate glass material. Such glass wafers are typically used for anodic bonding with silicon and MEMS-technology applications.

 

Depending on the version, our wafers have either polished or high-quality fire-polished surfaces. The fire-polished glass wafers often offer an even lower microroughness and better smoothness than mechanically polished glass materials do. Besides, our standard glass wafers usually provide excellent flatness and surface quality. In the case of fire-polished glass materials, these parameters ultimately are depending on the properties and precision of the raw glass. But they often are comparable or even better than what can be achieved with a standard mechanical glass polishing process. Numerous MEMS applications and a variety of micro-optical applications are based on these precision glass wafers. Electronic packaging of optoelectronic semiconductors is a common application for some of the thin and ultra-thin glass types. Many wafers made of these unique high-quality glass materials are used in science and research for a wide range of scientific applications.

We also manufacture glass wafers for moderate requirements that use more economically priced glass types like our selected float glass. This glass is often an option for the manufacturing of so-called "dummy wafers". Also such kind of glass-wafers are part of our daily production. They can lead to significant cost savings to the customer.

Our standard glass wafers can have SEMI-standard-flats as known from silicon wafers often used for the fabrication of semiconductors. As well the CNC-machining of custom-dimensions and shapes are part of our capabilities. At sufficiently large production quantities specific CNC-machining steps and a customized configuration design is possible. In the case of mass production, we can also carry out customer-specific edge form processing and to apply notches. In addition to the specifications listed in this data-sheet, we have the technology and capabilities for the precision fabrication of custom glass wafers with a decreased total thickness variation (TTV) and increased surface quality or custom polishing finishes. If you have any query about our glass-wafer manufacturing capabilities, please contact us.

Please use our inquiry form to request a quotation for your glass wafers made of borosilicate glass or from any other glass material based on a custom design. Or ask for an offer for our regularly obtainable glass-wafers that are listed on this website. Just click on one of the possible wafer thicknesses listed on this website to initiate the RFQ process.

To send an inquiry about a custom machined glass wafer you haven't found here, please click on the following button:

 

Request for quotation for
custom glass wafers

 

Standard Glass Wafers

The following wafers are available at almost any time in all common millimeter and inch diameters, usually even as part of our 48h-Express Optics Service.

 

Wafers, CNC-precision-cut, without bevel:

If required with SEMI-standard-flat (please specify if needed). TTV and surface quality depend on material:

 

Possible diameters in this version

(unless otherwise stated)
  • 50 mm / 2" (= 50,8 mm)
  • 75 mm / 3" (= 76,2 mm)
  • 100 mm / 4" (= 101,6 mm)
  • 150 mm / 6" (= 152,4 mm)
  • 200 mm / 8" (= 203,2 mm)
  • 300 mm / 12" (= 304,8 mm)

Please click on the desired thickness to request a quote for the respective wafer:

 

Wafer made of AF 32® eco (alkali-free glass)
 
Wafer made of AF 45 (alkali-free glass)
 
Wafer made of AS 87 eco (ultra-thin glass)
  • Thicknesses: 0,175 mm
  • Maximum diameter 200 mm or 8"
 
Wafer made of BK7 (optical glass)
 
Wafer made of BOROFLOAT® (borosilicate glass)
 
Wafer made of D 263 T (ultra-thin display glass)
 
Wafer made of EAGLE2000 (alkali-free glass)
 
Wafer made of 1737F (alkali-free glass)
 
Wafer made of MEMpax® (borosilicate thin-glass)
 
Wafer made of selected float glass
(soda-lime glass)
 
Wafer made of UV-grade quartz glass
(UV-grade fused silica)
  • Double side optically polished
  • Thicknesses: 0,30 mm ; 0,50 mm ; 1,00 mm
  • Transmission > 80% already at 185 nm
  • Maximum diameter 100 mm (without flat 150 mm)
 
Wafer made of ITO-Glass

 

Double Side Polished Wafers,
ground edge, C-shaped:

All wafers in this category have a primary SEMI-std-flat with a length of 32,5 mm (+/- 1,0).

 

Glass Wafers made of BOROFLOAT®
(borosilicate glass)
  • double side polished
  • optical quality polishing-finish
  • diameter: 100 mm
  • Thicknesses:
    0,500 (+/-0,025)
    0,525 (+/-0,025)
    0,700 mm (+/-0,025)
  • TTV < 10 µm
  • surface quality better than 60-40 s&d
  • SEMI-std-flat with a length of 32,5 mm (+/-1,0)
  • allows anodic bonding with silicon


48h-Express Service Also available in 48 h Express-Service
The wafers as mentioned above are nearly all constantly available also within the scope of our express service which offers the manufacturing, packaging, and shipping of glass wafers above within two working days. More...

 

Of course, other precision CNC-machining and precision polishing options are feasible for all glass wafers at larger batch quantities. Please send your inquiry in case the glass wafers above don't meet your MEMS or semiconductor process requirements or require special design, a sophisticated polishing finish or an increased flatness.

 

All given details and specifications are mean reference values and are not guaranteed. Also, please consider our "Notes on technical specifications".

 

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