The term "wafer" originally emerged in the semiconductor industry and refers to the typical shape of a round silicon wafer with SEMI-standard-flat (see picture "Typical glass wafer shape" below). Our extensive range of high quality glass-wafers includes wafers made from a wide selection of specialty glass materials.
For the semiconductor industry we regularly manufacture polished glass wafers made of borosilicate glass like BOROFLOAT® or MEMpax® from SCHOTT. Both materials have about the same coefficient of thermal expansion as PYREX 7740 glass from CORNING which has been discontinued many years ago. They represent higher-quality replacement materials for PYREX®. Such borosilicate glass wafers are often used for anodic bonding processes of glass with silicon as the thermal expansion of these materials is similar to the one of silicon.
As well we produce glass wafers of low-alkali or alkali-free glass like AF 32® eco, 1737F, EAGLE 2000, and AF 45 and also of optical glass types like BK7, UV-grade Fused Silica, or quartz glass. In addition we fabricate glass wafers from quality specialty thin and ultra-thin glass types like AS 87 eco or D 263 T and not least from our low-cost selected float glass materials. An overview about the glass materials we use for the production of glass wafers and the thicknesses available almost at any time can be found on this website under the heading "Standard Glass Wafers".
Depending on the version, our wafers have either polished or high-quality fire-polished surfaces. The fire-polished glass wafers often offer an even lower micro roughness and smoothness than mechanically polished glass materials do and our standard glass wafers usually offer an excellent flatness and surface quality. In the case of fire-polished glass materials these parameters ultimately are depending on the properties and precision of the raw glass. But they often are comparable or even better than what can be achieved with a standard mechanical glass polishing process. Numerous MEMS applications and a variety of micro-optical applications are based on these precision glass wafers. Electronic packaging of optoelectronic semiconductors is a common application for some of the thin and ultra thin glass types. Many wafers made of these high quality specialty glass materials are used in science and research for a wide range of scientific applications.
We also manufacture glass wafers for moderate requirements that are based on more economically priced glass types like our selected float glass. This glass is often used for the manufacturing of so-called "dummy wafers". Also such kind of glass-wafers are part of our daily production. They can lead to significant cost savings to the customer.
Our standard glass wafers can have SEMI-standard-flats as known from silicon wafers often used for the fabrication of semiconductors. As well the CNC-machining of custom dimensions and shapes are part of our capabilities. At sufficiently large quantities special CNC-machining steps and a customized configuration design is possible. In the case of bulk production also custom edge shape machining and notches can be realized. In addition to the specifications listed in this data sheet we have the technology and capabilities for the precision fabrication of custom glass wafers with a decreased total thickness variation (TTV) as well as for the manufacturing of an increased surface quality and custom polishing qualities. If you have any query about our glass-wafer machining options just contact us. We will gladly answer your questions.
Please use our inquiry form to request a quotation for your glass wafers made of borosilicate glass or from any other glass material based on a custom design. Or ask for an offer for our constantly obtainable glass-wafers that are listed on this website. Just click on one of the possible wafer thicknesses listed on this website to initiate the RFQ process.
In order to send an inquiry about a custom machined glass wafer you haven't found here, please click on the following button:
The following wafers are available at almost any time in all common millimeter and inch diameters, usually even as part of our 48h-Express Optics Service.
Please click on the desired thickness to request a quote for the respective wafer:
Also available in 48 h Express-Service
The above mentioned wafers are nearly all constantly available also within the scope of our express service which offers the manufacturing, packaging, and shipping of glass wafers above within two working days. more...
Of course other precision CNC-machining and precision polishing options are feasible for all glass wafers at larger batch quantities. Please send your inquiry in case the glass wafers above don't meet your MEMS or semiconductor process requirements or require a special design or a sophisticated polishing finish.
All given details and specifications are mean reference values and are not guaranteed. In addition please consider our "Notes on technical specifications"
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