Speciality Glass picture, EAGLE2000
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Alkali free boro-aluminosilicate glass

Special Properties

  • Lightweight glass due to low density
  • Low thermal expansion
  • Near zero alkali content
  • Low sagging
  • Color neutral clear appearance

Typical Applications

  • Lightweight AMLCD display substrate
  • Chip on glass (COG) applications
  • TFT-LCD manufacturing
  • High resolution displays
  • Sensor covers
  • Substrate for ITO-coated glass and optics
  • Substrates for coatings
  • Opto-electronics applications
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EAGLE2000 glass is a lightweight AMLCD alkaline earth boro-aluminosilicate glass from CORNING with interesting characteristics. It features a small specific weight and a low coefficient of thermal expansion. It is a near zero alkali glass material with a total alkali content of approximately 0,1 weight-% (typically < 0,05 weight-%). The fusion-drawn AMLCD glass provides the excellent flatness and a high surface quality that is indispensable for high resolution applications. Due to its low coefficient of thermal expansion, glass breakage caused by thermal shock often occurring in semiconductor applications, is reduced or eliminated. EAGLE2000 therefore has the properties mandatory to be used for in COG (chip on glass) processes. EAGLE2000 specialty glass from CORNING shows an even higher chemical durability than the older 1737 or 1737F materials. The high broadband and color neutral transmission and the low light absorption in combination with the low specific weight of EAGLE2000 quality glass make it an ideal solution for displays as well as for demanding optical and opto-electronic applications.


To request a quotation for windows or substrates at customized size, made of original Corning EAGLE2000 glass please click this button:


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Other materials from CORNING® in our large delivery program are 1737F, 0211, ULE® zero expansion glass, PYREX® 7740, and MACOR® machinable glass ceramic.



EAGLE2000 transmission preview

View optical transmission of EAGLE2000 glass


Refractive Index

  • nD = 1,5068 (589,3 nm)


  • 2,37 g/cm3 (20 °C)

Young's Modulus

  • 70,9 GPa

Poisson's Ratio

  • 0,23

Shear Modulus

  • 28,9 GPa

Coefficient of Thermal Expansion

  • 31,8 x 10-7/°C (0-300 °C)
  • 36,1 x 10-7/°C (25-670 °C)
    (room temperature to setting point)


  • Working Point (104 dPas): 1321 °C
  • Softening Point (107,6 dPas): 985 °C
  • Annealing Point (1013 dPas): 722 °C
  • Strain Point (1014,5 dPas): 666 °C

Electrical Properties

  • Dielectric Constant 5,181 (20 °C / 1 kHz)
  • Loss Tangent 0,4% (20 °C / 1 kHz)

Chemical Properties


5% NaOH

N/50 Na2CO3

5% HCL

Temp. (°C) 95 95 95
Reaction Time (h) 6 6 24
Weight loss
1,61 0,14 0,3

Standard Thicknesses



0,70 mm ±0,07
1,10 mm ±0,10


All given details and specifications are mean reference values and are not guaranteed. In addition please consider our "Notes on technical specifications"