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EAGLE XG®

Alkali-free alkaline earth boro-alumino-silicate glass

Special Properties

  • Alkali-free glass composition*
  • Low micro-roughness
  • Similar expansion coefficient to silicon
  • A high strain point allows for increased process temperatures
  • Contains no heavy metals
  • Display-grade surface quality
  • High dimensional stability
  • Excellent clarity
  • Increased chemical durability
  • Low specific weight
  • Outstanding electrical properties
  • Can be processed by cutting, grinding, and polishing

Typical Applications

  • Wafer-level optics
  • Modern LCD technology
  • Glass wafers for the semiconductor industry
  • Thin glass windows
  • High-resolution displays
  • Electronic packaging
  • Substrate for optical coatings

Related glass types

  • EAGLE2000
    Alkali-free boro-aluminosilicate glass from CORNING®
  • 1737F
    Alkali-free aluminosilicate glass from CORNING®
  • AS 87 eco
    Ultra-thin aluminosilicate glass from SCHOTT
  • AF 32® eco
    Alkali-free alumina-borosilicate thin glass from SCHOTT

 

Request for Quotation

48h-Express Service 48-hour express service

EAGLE XG® is an alkali-free alkaline earth boro-aluminosilicate glass made by CORNING®. It is a perfect material for the fabrication of wafer-level optics. The high-quality glass is produced by a unique fusion draw process, resulting in excellent flatness, smoothness, surface quality, and low nominal thickness tolerance. Due to its high material quality, EAGLE XG® is also ideal for the manufacturing of glass wafers and as a substrate for optical coatings.

EAGLE XG® glass offers exceptional dimensional stability, high chemical durability, and outstanding clarity. It provides all the features required for the manufacturing of modern LCDs and other advanced display technology. The thermal coefficient of expansion (CTE) of EAGLE XG® glass closely aligns with silicon, enabling a wide range of sophisticated semiconductor applications. Moreover, glass has been optimized for an increased strain point, allowing improved fabrication processes at higher temperatures.

EAGLE XG® is also an exciting material for scientific applications. The very low micro-roughness of the glass surfaces allows for special research projects that are impossible with most other glass materials.

EAGLE XG® is considered environmentally friendly because the glass does not contain heavy metals such as arsenic, barium or antimony.

 

To request a quote for custom-sized EAGLE XG® substrates or windows, please click the button below or select a thickness from the table.

 

Request for Quotation

 

*The total alkali content is approximately 0,1 weight-%.
(Typical < 0,05 weight-%)

 

Specifications


EAGLE XG® transmission at 0,7 mm
glass thickness

EAGLE XG® transmittance at 0,7 mm thickness

Enlarge the curve fto view more details

 

Additional Transmission Curves

0,30 mm glass thickness:

0,70 mm glass thickness:

1,10 mm glass thickness:

 

EAGLE XG® standard glass thicknesses

Please click on glass thickness to start a request:

Thickness (mm)

Tolerance

 48h-Express Service
0,30 ±0,02 ✔
0,70 ±0,02 ✔
1,10 ±0,02 ✔
The thicknesses marked with "✔" are also available within our 48-hour express service.
More glass thicknesses (0,2 mm, 0,21 mm, 0,25 mm, 0,4 mm, and 0,5 mm) are available on request if sufficient quantities are needed. Please send us your inquiry in case of need.

Optical Specifications

  • Abbe constant: 62,7
  • Birefringence constant: 331 (nm/cm)/(kg/mm2)

Refractive index numbers

Designation

Wavelength (nm)

Refractive Index
nF'
480
1,5159
nF
486,1
1,5154
ne
546,1
1,5119
nd
587,6
1,5099
nD
589,3
1,5097
632,8
1,5082
nC'
643,8
1,5077
nC
656,3
1,5073
850
1,5028
940
1,5013
 
980
1,5007
1000
1,5004

Mechanical Specifications

  • Density: 2,38 g/cm3
  • Young's modulus: 73,6 GPa
  • Poisson's ratio: 0,23
  • Shear modulus: 30,1 GPa
  • Vickers hardness (200 g load): 640 kgf/mm2
  • Fracture toughness 0,89 MPa × m0,5

Thermal Properties

  • Coefficient of expansion (CTE) as-formed (ppm/°C):
    • 3,4 (0–300 °C)
    • 3,4 (20–260 °C)
  • Viscosities:
    • Softening Point (107,6 dPa): 971 °C
    • Annealing Point (1013 dPa): 722 °C
    • Strain Point (1014,5 dPa): 669 °C

Thermal Conductivity

(specific heat × thermal diffusivity × glass density)
Temperature
(°C)
Specific heat
(J/kg×K)
Diffusivity
(cm2/sec)
Conductivity
(W/m×K)
25
768
0,0060
1,10
100
896
0,0057
1,22
200
998
0,0055
1,30
300
1067
0,0053
1,35
400
1110
0,0052
1,38
500
1154
0,0052
1,42

 

Chemical Capabilities

  • Weathering: Class 1
    Weathering is defined by atmospheric-borne gases and vapors such as water and carbon dioxide. A glass rated 1 will rarely show weathering effects. Those rated 2 will occasionally be troublesome, particularly if weathering products cannot be removed. Glass types rated 3 require the most careful consideration.

Chemical Durability

Solution

Reaction time/
Temperature

Weight loss
(mg/cm2)
HCl – 5 %
24 h at 95 °C
0,79
HNO3 – 1M
24 h at 95 °C
0,49
HF – 10 %
20 min. at 20 °C
5,18
NH4F:HF – 10 %
20 min. at 20 °C
0,84
1HF:10HNO3
3 min. at 20 °C
1,48
1HF:100HNO3
3 min. at 20 °C
0,16
DI H2O
24 h at 95 °C
0,00
Na2CO3 - 0,02N
6 h at 95 °C
0,16
NaOH - 5 %
6 h at 95 °C
1,83

 

Electrical Properties

Dielectric Constant & Dissipation Factor
Frequency
(GHz)
Dielectric
Constant
Loss
Tangent
0,1
5,28
0,002
1
5,30
0,002
2,5
5,18
0,004
10
5,14
0,008
15
5,14
0,008
24
5,14
0,009
60
5,11
0,011
70
5,11
0,013

Volume Resistivity (25–500°C)
Temperature
(°C)
Log10 Volume Resistivity
(Ω-cm)
25
22,92
250
12,98
350
10,87
500
8,72

Other Specifications (0,5 mm thickness)

  • Dielectric strength: 217 kV/mm
  • Breakdown voltage: 107 kV

EAGLE is an acronym for "Enhanced Attribute Glass for Large-Area Electronics". The XG in the product name stands for "extra green".

 

Other CORNING® materials in our extensive delivery program are EAGLE2000, 1737F, 7059, PYREX®, MACOR®, and ULE®. For further technical details, please feel free to send an information inquiry.


All given details and specifications are mean reference values and are not guaranteed. Also, please consider our "Notes on technical specifications".

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Last update: April 18, 2024