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High-quality thin borosilicate glass

Special Properties

  • Very low thickness tolerance
  • Excellent surface quality and flatness
  • Low thermal expansion similar to the one of silicon
  • High operating temperature
  • Low autofluorescence
  • High UV-Transmission
  • Excellent chemical resistance
  • Good electrical insulation properties
  • Low specific weight
  • High light transmission
  • Very low micro roughness

Typical Applications

  • Glass wafers for anodic bonding
  • Micro electro mechanical systems (MEMS)
  • Biotech research
  • Sensor applications
  • Chemically resistant microscope slides and cover-slips
  • Thin glass wafer applications

Related glass types

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MEMpax® is a new thin glass with the exceptional technical properties of borosilicate glass. The material features a very smooth high-quality surface and features an excellent flatness. Resulting from a sophisticated fire polishing process the thin glass has an utmost low micro-roughness of typically < 0,8 nm. In most cases, the high surface quality of MEMpax® permits direct use without having it to be additionally mechanically polished. The thermal coefficient of expansion of MEMpax® is close to the one of silicon making this material a perfect choice for wafers for anodic bonding applications. Further typical uses for the high purity borosilicate-thin glass are MEMS applications (micro electro mechanical systems) as well as biotechnology applications. MEMpax® is a registered trademark of SCHOTT.


To receive a quotation for windows or substrates made of MEMpax® with individual dimensions, please click the button below:


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Note: In case you plan a large serial production but none of the listed currently available glass thicknesses in the table match the technical requirements of your application please contact us. During the introduction-stage of MEMpax® we can take care that the thickness you need might be molten by SCHOTT in the future in addition to the existing thicknesses. Of course, this requires that the amount of material you need is large enough.




VIS-NIR Transmission

MEMpax® optical transmission

Transmission of MEMpax at 200-1100 nm


UV-Transmission at 0,5 mm thickness

MEMpax® UV-Transmission

UV-Transmission of MEMpax at 200-400 nm


Optical Properties

  • Abbe Constant ve: 65,4

Index of Refraction of MEMpax

Wavelength (nm)
Refractive Index

Mechanical Properties

  • Density: 2,22 g/cm3 (cooling rate 40 °C/h)
  • Young's modulus E: 62,7 kN/mm2
  • Poisson's ratio μ: 0,196
  • Torsion modulus: 26,2 kN/mm2
  • Knoop hardness HK0,1/20: 430

Thermal Properties

  • Average coefficient of thermal expansion:
    3,3 x 10-6/K (20 °C ; 300 °C)
    (static measurement)
  • Specific heat capacity cP: 0,82 kJ (kg x K)-1
  • Specific heat conductivity: 1,12 W (m x K)-1 (90 °C)
  • Transformation temperature Tg: 532 °C
  • Viscosities:
    • Working Point (104 dPa): 1284 °C
    • Softening Point (107,6 dPa): 831 °C
    • Annealing Point (1013 dPa): 570 °C
    • Strain Point (1014,5 dPa): 528 °C

Chemical Properties

  • Hydrolytic Resistance:
    • Class HGB 1 (according to ISO 719)
  • Acid Resistance:
    • Class S 1 (according to DIN 12 116)
  • Alkali Resistance:
    • Class A 2 (according to ISO 695)

Electrical Properties

  • Dielectric Constant εr: 4,8 (1 MHz)
  • Loss Tangent (tan δ): 37,6 x 10-4 (1 MHz)
  • Specific Electrical Volume Resistivity (DC):
    • 1,18 x 108 Ω x cm (250 °C)
    • 4,24 x 106 Ω x cm (350 °C)

Standard Thicknesses

Thickness Tolerance Thickness Tolerance
0,20 mm ±0,012 0,30 mm ±0,012
0,40 mm ±0,015 0,50 mm ±0,018
All given details and specifications are mean reference values and are not guaranteed. Also, please consider our "Notes on technical specifications".

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