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MEMpax®

High-quality borosilicate thin glass

Special Properties

  • Minimal thickness tolerance
  • Excellent surface quality and flatness
  • Low thermal expansion similar to the one of silicon
  • High operating temperature
  • Low autofluorescence
  • High UV-Transmission
  • Excellent chemical resistance
  • Good electrical insulation properties
  • Low specific weight
  • High light transmission
  • Very low micro-roughness

Typical Applications

  • Glass wafers for anodic bonding
  • Micro electro-mechanical systems (MEMS)
  • Biotech research
  • Sensor applications
  • Chemically resistant microscope slides and cover-slips
  • Thin glass wafer applications

Related glass types

  • BOROFLOAT® 33
    (Borosilicate glass from SCHOTT)
  • D 263 T
    (Thin and ultra-thin SCHOTT borosilicate display glass)
  • AS 87 eco
    (Ultra-thin aluminosilicate glass from SCHOTT)
  • AF 32® eco
    (Alkali-free alumina-borosilicate glass from SCHOTT)
  • AF 45
    (Modified borosilicate display glass from SCHOTT)
  • 0211
    (Alkali reduced borosilicate thin glass from CORNING)
  • Selected float glass
    (Iron reduced soda-lime thin glass)

Request for Quotation

48h-Express Service Also available in 48 h Express-Service

MEMpax® is a new thin glass with the exceptional technical properties of borosilicate glass. The material features a very smooth, high-quality surface and features an excellent flatness. A sophisticated fire polishing process enables the thin glass to have an extremely low micro-roughness of typically less than 0,8 nm. In most cases, the high surface quality and flatness of MEMpax® permit direct use without the necessity of additional mechanical polishing. The thermal coefficient of expansion of MEMpax® is close to silicon, making this material a perfect choice for wafer applications in anodic bonding processes. Further typical uses for the high purity borosilicate-thin glass are MEMS applications (micro-electro-mechanical systems) and biotechnology applications. MEMpax® is a registered trademark of SCHOTT.

To receive a quotation for wafers, windows, or substrates made of MEMpax® materials with specific dimensions, please select a thickness from the table in the specifications or click the button below.

 

Request for Quotation


Note: If you plan a sizeable serial production, but none of the listed currently available glass thicknesses in the table match the technical requirements of your application, please contact us. During the introduction stage of MEMpax®, we can ask SCHOTT to melt the glass thickness you need in the future. Of course, this requires an amount of material large enough.

 

Specifications


VIS-NIR Transmission

MEMpax® optical transmission
Transmission of MEMpax at 200-1100 nm


UV-Transmission at 0,5 mm thickness

MEMpax® UV-Transmission
UV-Transmission of MEMpax at 200-400 nm


Standard Thicknesses

(Please click on a glass thickness to request a quote)

Thickness (mm)

Tolerance

48h-Express Service
0,200 ±0,012
0,300 ±0,012
0,400 ±0,015
0,500 ±0,018
The thicknesses marked with "" are also available within 48–h Express Service.

If you need a glass with a larger thickness, SCHOTT BOROFLOAT® 33 is an alternative because it has almost the same thermal expansion, refractive index, and density as MEMpax®. BOROFLOAT® 33 is available in an extensive range of thicknesses from 0.7 mm upwards.

Optical Properties

  • Abbe Constant ve: 65,4

Index of Refraction of MEMpax

Title
Wavelength (nm)
Refractive Index
ng
435,8
1,4803
nF'
479,9
1,4768
ne
546,1
1,4732
nd
587,6
1,4715
nD
589,3
1,4714
nC'
643,8
1,4696
nC
656,3
1,4693

Mechanical Properties

  • Density: 2,22 g/cm3 (cooling rate 40 °C/h)
  • Young's modulus E: 62,7 kN/mm2
  • Poisson's ratio μ: 0,196
  • Torsion modulus: 26,2 kN/mm2
  • Knoop hardness HK0,1/20: 430

Thermal Properties

  • Average coefficient of thermal expansion:
    3,3 x 10-6/K (20 °C ; 300 °C)
    (static measurement)
  • Specific heat capacity cP: 0,82 kJ (kg x K)-1
  • Specific heat conductivity: 1,12 W (m x K)-1 (90 °C)
  • Transformation temperature Tg: 532 °C
  • Viscosities:
    • Working Point (104 dPa): 1284 °C
    • Softening Point (107,6 dPa): 831 °C
    • Annealing Point (1013 dPa): 570 °C
    • Strain Point (1014,5 dPa): 528 °C

Chemical Properties

  • Hydrolytic Resistance:
    • Class HGB 1 (according to ISO 719)
  • Acid Resistance:
    • Class S 1 (according to DIN 12 116)
  • Alkali Resistance:
    • Class A 2 (according to ISO 695)

Electrical Properties

Dielectric Constant (permittivity) εr

Frequency in GHz
0,001
1,0
2,0
5,0
24
77
 
4,8
4,4
4,5
4,4
4,4
4,5

Loss Tangent tan(δ) x 10-4

Frequency in GHz
0,001
1,0
2,0
5,0
24
77
 
37,6
58
62
73
130
140
  • Specific AC-Volume Resistivity ρD (Ω x cm):
    • 1,18 x 108 (250 °C)
    • 4,24 x 106 (350 °C)
All given details and specifications are mean reference values and are not guaranteed. Also, please consider our "Notes on technical specifications".

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