SHAPAL™ Hi M-soft

Special Properties

• Excellent machinability
• High strength
• Suitable for vacuum environments
• Good heat dissipation
• Approx. five times higher thermal conductivity than aluminum oxide ceramic
• Outstanding electrical insulation
• Low coefficient of expansion
• Remarkable high-frequency properties
• Operating temperature up to 1000 °C
  (up to 1900 °C in a non-oxidizing atmosphere)

Typical Applications

• Vacuum applications
• Specialty ceramic heat sinks for electronics
• High precision workpieces
• Small series and prototypes
• Components made of low expansion ceramics

Related ceramics products

• MACOR^® (Machinable Glass Ceramic (MGC))
• Al₂O₃ Aluminum Oxide
  (Alumina high-performance ceramics
  

SHAPAL™ Hi M-soft ceramic offers the properties of ceramics without their typical disadvantages

Ceramic materials have unique properties that metals or other materials cannot offer. But as a rule, the processing of ceramics involves a great deal of effort because such materials usually are hard and brittle. The SHAPAL Hi M-soft aluminum nitride ceramic overcomes this disadvantage because it is machinable while still offering excellent strength. SHAPAL Hi M-soft ceramic contains particles of crystals with lamellar shapes that prevent cracks on the surface when cutting deep into the material.

SHAPAL Hi M-soft material also has impressive electrical specifications. It provides a very high insulation resistance and excellent high-frequency properties like a low dielectric loss factor and a small dielectric constant. Hence, electrical insulators are often made of SHAPAL ceramic. SHAPAL offers superior heat dissipation, which allows using aluminum nitride ceramics for heat sink applications.

To request a quote for your individually shaped SHAPAL™ Hi M-soft ceramic workpieces, please click the button below:

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SHAPAL™ Hi M-soft is a registered trademark of Tokuyama, Japan.

 

Specifications & Properties

 

Density

• 2,88 g/cm³ (4 °C)

Coefficient of Thermal Expansion

• 4,8 × 10^-6 / °C (RT-400 °C)
• 4,9 × 10^-6 / °C (RT-600 °C)
• 5,0 × 10^-6 / °C (RT-800 °C)

Thermal Conductivity

• 100 W/mK (-100 °C)
• 92 W/mK (25 °C)
• 55 W/mK (500 °C)
• 35 W/mK (1000 °C)

Operating Temperature

• up to 1000 °C (in air)
• up to 1900 °C (in a non-oxidizing atmosphere)

Thermal shock resistance

• up to 400 °C (when quenched with water)

Mechanical Characteristics

• Porosity: 0% (25 °C)
• Young's Modulus (25 °C): 176 GPa
• Poisson's Ratio: 0,31
• Vickers Hardness (25 °C ; 300g): 380 kg/mm²
• Bending strength:
  
  • 340 MPa (-100 °C)
  • 300 MPa (25 °C)
  • 325 MPa (500 °C)
  • 350 MPa (1000 °C)
• Compressive Strength: 980 MPa

Electrical Characteristics

• Dielectric Constant (25 °C ; 1 MHz): 6,8
• Dissipation Loss (25 °C ; 1 MHz): 0,001
• Dielectric Strength (25 °C): 65 KV / mm
  
• Volume Resistivity:
  • 1,0 × 10¹⁵ Ω x cm (25 °C)
  • 3,2 × 10¹⁰ Ω x cm (500 °C)
  • 4,6 × 10⁵ Ω x cm (1000 °C)
    

Chemical Durability of SHAPAL Hi M-soft ceramic (Typical values, no guarantee)
Medium	Time		Temp. (°C)	Weight loss (mg/cm2)
10 % HCL	24 h		20 °C	ca. 0,2
10 % NaOH	2 h		20 °C	ca. 1,7

All given details and specifications given here are mean reference values and are not guaranteed. Also, please consider our "Notes on specifications".

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