SHAPAL™ Hi M-soft

Special Properties

• Excellent machinability
• High strength
• Suitable for vacuum environments
• Good heat dissipation
• Approximately five times higher thermal conductivity than aluminum oxide ceramic
• Outstanding electrical insulation
• Low coefficient of expansion
• Remarkable high-frequency properties
• Operating temperature up to 1000 °C
  (up to 1900 °C in a non-oxidizing atmosphere)

Typical Applications

• Vacuum applications
• Specialty ceramic heat sinks for electronics
• High-precision workpieces
• Small series and prototypes
• Components made of low expansion ceramics

Related ceramic products

• MACOR^® (machinable glass ceramic (MGC))
• Al₂O₃ Aluminum Oxide
  (Alumina high-performance ceramics)
  

SHAPAL™ Hi M-soft ceramic offers the properties of ceramics without their typical disadvantages

Ceramic materials have unique properties that metals or other materials cannot offer. But as a rule, the processing of ceramics involves a great deal of effort because such materials are usually hard and brittle. The SHAPAL Hi M-soft aluminum nitride ceramic overcomes this disadvantage because it is machinable while still offering excellent strength. SHAPAL Hi M-soft ceramic contains particles of crystals with lamellar shapes that prevent cracks on the surface when cutting deep into the material.

SHAPAL Hi M-soft material also has impressive electrical specifications. It provides very high insulation resistance and exceptional high-frequency properties like a low dielectric loss factor and a small dielectric constant. Hence, electrical insulators are often made of SHAPAL ceramic. SHAPAL offers superior heat dissipation, which allows the use of aluminum nitride ceramics for heat sink applications.

To request a quote for your individually shaped SHAPAL™ Hi M-soft ceramic workpieces, please click the button below:

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SHAPAL™ Hi M-soft is a registered trademark of Tokuyama, Japan.

 

Specifications and Properties

 

Density

• 2,88 g/cm³ (4 °C)

Coefficient of Thermal Expansion

• 4,8 × 10^-6 / °C (RT-400 °C)
• 4,9 × 10^-6 / °C (RT-600 °C)
• 5,0 × 10^-6 / °C (RT-800 °C)

Thermal Conductivity

• 100 W/mK (-100 °C)
• 92 W/mK (25 °C)
• 55 W/mK (500 °C)
• 35 W/mK (1000 °C)

Operating Temperature

• up to 1000 °C (in air)
• up to 1900 °C (in a non-oxidizing atmosphere)

Thermal shock resistance

• up to 400 °C (when quenched with water)

Mechanical Characteristics

• Porosity: 0% (25 °C)
• Young's Modulus (25 °C): 176 GPa
• Poisson's Ratio: 0,31
• Vickers Hardness (25 °C ; 300g): 380 kg/mm²
• Bending strength:
  
  • 340 MPa (-100 °C)
  • 300 MPa (25 °C)
  • 325 MPa (500 °C)
  • 350 MPa (1000 °C)
• Compressive Strength: 980 MPa

Electrical Characteristics

• Dielectric Constant (25 °C ; 1 MHz): 6,8
• Dissipation Loss (25 °C ; 1 MHz): 0,001
• Dielectric Strength (25 °C): 65 KV / mm
  
• Volume Resistivity:
  • 1,0 × 10¹⁵ Ω x cm (25 °C)
  • 3,2 × 10¹⁰ Ω x cm (500 °C)
  • 4,6 × 10⁵ Ω x cm (1000 °C)
    

Chemical Durability of SHAPAL Hi M-soft ceramic (Typical values; no guarantee.)
Medium	Time		Temp. (°C)	Weight loss (mg/cm2)
10 % HCL	24 h		20 °C	ca. 0,2
10 % NaOH	2 h		20 °C	ca. 1,7

All given details and specifications given here are mean reference values and are not guaranteed. Also, please consider our "Notes on specifications".

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