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MEMpax® Borosilicate Glass

Very high quality borosilicate thin glass

Special Properties

  • Low thermal expansion similar to silicon
  • High operating temperature
  • Low auto fluorescence
  • High UV-Transmission
  • Very good chemical resistance
  • Good electrical insulation properties
  • Low specific weight
  • High light transmission
  • Excellent surface quality
  • Very low micro roughness

Typical Applications

  • Glass wafers for anodic bonding
  • Micro electro mechanical systems (MEMS)
  • Biotech research use
  • Sensor applications
  • Chemically resistant microscope slides and cover slips
  • Thin glass wafer applications

MEMpax® is a new thin glass with the exceptional technical properties of borosilicate glass. The material features a very smooth surface. Resulting from a sophisticated fire polishing process, the thin glass has an utmost low micro roughness of typically <0,8nm. In most cases, the high surface quality of the glass permits direct use, without having to be additionally mechanically polished. The thermal coefficient of expansion of MEMpax® is close to the one of silicon, making this material a perfect choice for wafers for anodic bonding applications. Other typical uses for this high purity borosilicate-thin glass are MEMS applications (micro electro mechanical systems), biotechnology and borosilicate-thin glass wafer applications. MEMpax® is a registered trademark of SCHOTT.

For a quotation for windows or substrates made of MEMpax® with individual dimensions, please click the button below:

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Note: In case you plan a large serial production, but none of the listed currently available thicknesses on the right side match the technical requirements of your application, please contact us. During the introduction stage of MEMpax®, we can take care that the thickness you need might be molten by SCHOTT in the future in addition to the existing thicknesses. Of course this is depending on that the amount of material you need is large enough.


VIS-NIR Transmission

MEMpax® optical transmission

Transmission of MEMpax at 200-1100nm


UV-Transmission at 0,5mm thickness

MEMpax® UV-Transmission

UV-Transmission of MEMpax at 200-400nm


Optical Properties

  • Abbe Constant ve: 65,4

Index of Refraction of MEMpax

Wavelength (nm)
Refractive Index

Mechanical Properties

  • Density: 2,22 g/cm3 (cooling rate 40°C/h)
  • Young's modulus E: 62,7 kN/mm2
  • Poisson's ratio μ: 0,196
  • Torsion modulus: 26,2 kN/mm2
  • Knoop hardness HK0,1/20: 430

Thermal Properties

  • Average coefficient of thermal expansion:
    3,3 x 10-6/K (20 ; 300°C) (static measurement)
  • Specific heat capacity cP: 0,82 kJ (kg x K)-1
  • Specific heat conductivity: 1,12 W (m x K)-1 (90°C)
  • Transformation temperature Tg: 532°C
  • Viscosities:
    • Working Point (104 dPa): 1284°C
    • Softening Point (107,6 dPa): 831°C
    • Annealing Point (1013 dPa): 570°C
    • Strain Point (1014,5 dPa): 528°C

Chemical Properties

  • Hydrolytic Resistance:
    • Class HGB 1 (according to ISO 719)
  • Acid Resistance:
    • Class S 1 (according to DIN 12 116)
  • Alkali Resistance:
    • Class A 2 (according to. ISO 695)

Electrical Properties

  • Dielectric Constant εr: 4,8 (1 Mhz)
  • Loss Tangent (tan δ): 37,6 x 10-4 (1 Mhz)
  • Specific Electrical Volume Resistivity (DC):
    • 1,18 x 108 Ω x cm (250°C)
    • 4,24 x 106 Ω x cm (350°C)

Standard Thicknesses

Thickness Tolerance Thickness Tolerance
0,20mm ±0,012 0,30mm ±0,012
0,40mm ±0,015 0,50mm ±0,018

All given details and specifications are mean reference values and are not guaranteed. In addition, please consider our "Notes on technical specifications"