The term "wafer" originally emerged in the semiconductor industry and refers to the typical shape of a round silicon wafer with a flat (see picture "Typical glass wafer shape" below). Our extensive range of high quality glass-wafers includes wafers made from a wide selection of specialty glass materials.
For the semiconductor industry we regularly manufacture polished glass wafers made of borosilicate glass like BOROFLOAT® or MEMpax® from SCHOTT. Both materials have about the same coefficient of thermal expansion as the discontinued PYREX 7740 glass from CORNING. Hence, they both represent high-quality replacement materials for PYREX®. Those wafers are often used for anodic bonding processes of glass with silicon, because the thermal expansion of these materials is close to the one of silicon.
As well, we produce wafers of low-alkali or alkali-free glass like AF 32® eco, 1737F, EAGLE 2000 and AF 45 and of optical glass types like BK7, UV-grade Fused Silica or quartz glass. Furthermore we fabricate glass wafers from quality specialty glass types like AS 87 eco or D 263 T and not least from our low-cost selected float glass materials. An overview about the glass materials we use for the production of glass wafers and the thicknesses available almost at any time can be found on this website under the heading "Standard Glass Wafers" on the right.
Our wafers have, depending on the version, either polished or high-quality fire-polished surfaces. The fire-polished glass wafers often offer an even better micro roughness and smoothness than mechanically polished glass materials do. Furthermore, our standard glass wafers usually offer an excellent flatness and surface quality. In the case of fire-polished glass materials, these parameters ultimately are depending on the properties and precision of the raw glass, but they often are comparable or even better than what can be achieved with a standard mechanical glass polishing process. Numerous MEMS applications and a variety of other micro-optical applications are based on these precision glass wafers. Electronic packaging of optoelectronic semiconductors is a common application for some of the thin and ultra thin glass types. Many wafers made of these high quality specialty glass materials are used in science and research for a wide range of scientific applications.
We also process glass wafers for more moderate requirements that are made of more economical glass types like our selected float glass. This glass is often used for the manufacturing of so-called "dummy wafers". Such kind of glass-wafers are also part of our daily production. They can lead to significant cost savings to customer's applications.
Our standard glass wafers can have a SEMI-standard flat, like most silicon wafers used for the manufacturing of semiconductors have. As well, the CNC-machining of custom dimensions and shapes is part of our capabilities. At sufficiently large quantities, special CNC-machining steps and a customized edge configuration design is possible. In the case of bulk production-batches, also custom edge shape machining and notches can be applied. In addition to the specifications listed in this data sheet, we have the technology and capabilities for the precision fabrication of custom glass wafers with a decreased total thickness variation (TTV) as well as for the manufacturing of an increased surface quality and custom polishing qualities if required. If you have any query about our glass-wafer machining options and capabilities, just contact us. We will gladly answer your questions.
Please use our inquiry form to request a quotation for your glass wafers made of borosilicate glass or from any other glass material based on a customized design. Or ask for an offer for our constantly obtainable glass-wafers that are listed in this website. Just click on one of the possible wafer thicknesses listed on the right to initiate the RFQ process.
In order to send an inquiry about a custom machined glass wafer you haven't found in this website, please click on the following button:
The following glass wafers are available practically at any time, usually even within the scope of our 48h-Express Optics Service. Please click on the desired thickness to request a quote for the respective wafer:
Of course other precision CNC-machining and precision polishing of all glass wafers is possible at batch quantities. Please send your inquiry in case the glass wafers above don't meet your MEMS or semiconductor process requirements or require a special design or polishing finishes.
All given details and specifications are mean reference values and are not guaranteed. In addition, please consider our "Notes on technical specifications"