PYREX^®Borosilicate Glass

Special Properties

High thermal resistance
Low thermal expansion
Good thermal shock resistance
Thermal expansion matches silicon (anodic bonding)
Low specific weight

Typical Applications

Substrate for dielectric coatings
PYREX Wafers for anodic bonding
Sensor substrates
Heat shields
Neutron absorbers
High temperature applications
Harsh environments

PYREX comes in unpolished glass blocks or as rolled material. It can be sawn, ground, polished and shaped according to customer-specific requirements.

PYREX^® is a technical borosilicate glass composition from Corning with excellent thermal properties. A low coefficient of thermal expansion allows a good heat shock resistance and facilitates the use of PYREX glass at high operating temperatures. Wafers made of PYREX are an ideal solution for PYREX raw material anodic bonding processes, as the thermal coefficient of expansion almost perfectly matches to silicon. A good acid resistance and a high optical transmission over a wide wavelength range make PYREX a versatile material for many different special glass applications. PYREX can be ground, polished and coated according to customer-specific requirements. PYREX glass is also available in rods at many different diameters. These PYREX rods allow an economical manufacturing of diameter or plano convex cylinder lenses.