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Home / Products / Optical Substrates / BOROFLOAT®, PYREX®7740 & MEMpax® Wafers, Glass Wafers made of Borosilicate Glass

Borosilicate Glass Wafers

Wafers made of BOROFLOAT®, PYREX® and MEMpax® Glass

Typical Applications

  • Glass wafers for anodic bonding with silicon wafers
  • Semiconductor technology
  • Micro lithography
  • Optical substrates
  • Micro system technology
  • Microelectromechanical systems (MEMS)
  • Substrate for electronic circuits
  • Microstructuring applications

Borosilicate glass wafer with SEMI-standard flat

PYREX 7740 Glass wafer made for the semiconductor industry

The picture shows a CNC-shaped double side polished PYREX® 7740 glass wafer with a SEMI-standard flat. Such kind of glass wafers are often used for semiconductor technology applications like the process of anodic bonding silicon to glass.


Glass wafers in clean room tray packaging

Clean room compatible glass wafer packaging

At sufficient quantities, we clean and package glass wafers according to clean room standard (class 1000).


Our high quality precision borosilicate glass wafers are made of BOROFLOAT®, MEMpax® or PYREX® 7740 glass and feature high quality polished or fire polished surfaces. They offer an excellent flatness and a low TTV. The thermal coefficient of expansion of all three borosilicate glass materials is close to the one of silicon, allowing sophisticated applications in the semiconductor industry. Therefore, our wafers can be used for anodic bonding processes (silicon to glass), MEMS and various other optics and micro-optical applications.

All of our stock borosilicate glass wafers, that are based on BOROFLOAT®, feature a primary SEMI standard flat. On demand, and at sufficient production quantities, we manufacture custom specific dimensions and shapes and we process any other high quality wafer glass material. At industrial production quantities, special CNC-machining, polishing finishes and clean room compatible packaging processes are part of our capabilities.

We further process customized glass wafers of any other suitable glass materials like quartz glass, fused silica or based on other high grade precision glass materials. If required, the shape of the glass wafer can be round or it can have one or two SEMI-standard flats or a SEMI-standard notch. The wafers can just have a precision-cut glass edge, as it is the case for low-cost options, or they can have a ground and seamed or C-shaped edge. At larger volumes also a machining of wafers with other features like custom notches or special shapes as the are are common in the semiconductor industry are within our manufacturing capabilities.

In addition, we manufacture glass wafers based on more economically priced glass materials, which are often used as so called "dummy wafers", resulting in large savings in all cases with moderate requirements. Besides the borosilicate glass materials mentioned above, which are mainly used for semiconductor or silicon based devices, we process glass wafer components based on any of the following glass materials:

Please use our inquiry form to receive your quotation for custom made glass wafers made of borosilicate glass or of any other glass material listed above. In addition to what is shown in this data-sheet, custom polishing qualities, a reduced total thickness variation (TTV) as well as enhanced surface qualities are possible options. Just contact us if you have any technical queries. Please use the button below to place your enquiry for any kind of glass wafers:

 

Request for Quotation

 

 

 

Note: As the production of PYREX® 7740 raw glass material was discontinued a long time ago, we only stock a small remaining stock of this raw material. Therefore we focus on the production of glass wafers made of the borosilicate glass materials BOROFLOAT® and MEMpax®. Those materials offer a superior glass quality and an almost identical density, almost the same refractive index and almost identical coefficient of thermal expansion, as well as a better purity than PYREX® offered.

 

Typical Specifications

Refractive Index

Density

Coefficient of Thermal Expansion

Dielectric Constant

  • BOROFLOAT® & PYREX® : 4,6 (20 °C ; 1 Mhz)
  • MEMpax®: 4,8 (20 °C ; 1 Mhz)

Common Glass Wafer Sizes

  • ø100mm or ø 4" Wafer
    (Flat: 32,5 mm +/-1,0)
  • ø125mm or ø 5" Wafer
    (Flat: 37,5 mm +/-1,0)
  • ø150mm or ø 6" Wafer
    (Flat: 42,5 mm +/-1,0)
  • ø200mm or ø 8" Wafer
    (Flat: 57,5 mm +/-1,0)
  • Other glass wafer size, thicknesses
    and other flats or secondary flats per inquiry

TTV (total thickness variation)

  • per inquiry
    (limits depend on glass material, thickness, wafer size and shape of the glass wafers)

Surface Quality & Polishing Finishes

  • typical 60-40 scratch & dig (MIL-0-13830A)
  • other surface quality and polishing finishes are available per inquiry


All given details and specifications are mean reference values and are not guaranteed. In addition, please consider our "Notes on technical specifications"